Does your prototyping project require soldering? Are you looking for something other than your usual run-o'-the-mill solder wire? Look no further! This high quality, low cost, adorably packaged Lead-Free Prototyping Solder Paste from IC Breakout will provide strong, flux-aided conductive bonds for your board.
This paste is now reformulated to melt at very low temperatures - only 140 °C!
Since it’s premixed, all you need to do is screw on the self-piercing cap, squeeze the paste onto your solder pads, and heat it up using a soldering iron, oven, or any other thermal source to reach the reflow temperature of 140 °C (284 °F). Once liquidus, remove your heat source and let it cool.
The lead free metal content is a mix of Bismuth, Tin and Silver. The mix is a eutectic solder, meaning that it’s either going to be a solid or liquid during re-flow; not something in between.
- Lead free
- No clean-up
- Clear residue
- Premixed, ready to use
- Low temperature use
- Bi57 42Sn Ag1
- ~10 grams
- Liquidus at 140 °C (284 °F)
|Part. No. :||3217|
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